NSI45090JDT4G
http://onsemi.com
8
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C
ISSUE E
b
D
E
b3
L3
L4
b2
M
0.005 (0.13)
C
c2
A
c
C
Z
DIM    MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
D    0.235    0.245
5.97
6.22
E    0.250    0.265
6.35
6.73
A    0.086    0.094
2.18
2.38
b    0.025    0.035
0.63
0.89
c2    0.018    0.024
0.46
0.61
b2    0.028    0.045
0.72
1.14
c
0.018    0.024
0.46
0.61
e
0.090 BSC
2.29 BSC
b3    0.180    0.215
4.57
5.46
L4
    0.040

1.01
L    0.055    0.070
1.40
1.78
L3    0.035    0.050
0.89
1.27
Z    0.155

3.93

NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
7. OPTIONAL MOLD FEATURE.
1    2
3
4
5.80
0.228
2.58
0.102
1.60
0.063
6.20
0.244
3.00
0.118
6.17
0.243
mm
inches
SCALE 3:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
H    0.370    0.410
9.40    10.41
A1   0.000    0.005
0.00
0.13
L1
0.114 REF
2.90 REF
L2
0.020 BSC
0.51 BSC
A1
H
DETAIL A
SEATING
PLANE
A
B
C
L1
L
H
L2
GAUGE
PLANE
DETAIL A
ROTATED 90 CW
5
e
BOTTOM VIEW
Z
BOTTOM VIEW
SIDE VIEW
TOP VIEW
ALTERNATE
CONSTRUCTION
NOTE 7
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reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
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limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
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